TPC invests in major chip R&D project at Zarlink

Guest Contributor
November 2, 2006

Technology Partnerships Canada (TPC) has invested $7.1 million in Ottawa's Zarlink Semiconductor Inc as part of a $29.8-million R&D project to develop next-generation semiconductor chips. The new chips will facilitate the transition from circuit-switched networks to packet-switched networks based on Internet Protocol (IP). They will allow network operators to continue using old equipment as they move to IP technology. TPC's contribution is repayable based upon royalties of future sales....


Other News






Events For Leaders in
Science, Tech, Innovation, and Policy


Discuss and learn from those in the know at our virtual and in-person events.



See Upcoming Events










You have 1 free article remaining.
Don't miss out - start your free trial today.

Start your FREE trial    Already a member? Log in






Top

By using this website, you agree to our use of cookies. We use cookies to provide you with a great experience and to help our website run effectively in accordance with our Privacy Policy and Terms of Service.